VVV
Advanced Member level 5
The primary ground can be left floating.
The secondary ground does not have to be tied to chassis, unless this is a requirement. But you can add capacitance between the secondary ground and chassis.
There is also in general a Y-capacitor between the input GND and output GND.
I think at this point I am most concerned about that heatsink that you say is connected to chassis. What is on that heatsink?
Here is an appnote that may give you some idea. https://www.onsemi.com/pub/Collateral/AND8032-D.PDF
The secondary ground does not have to be tied to chassis, unless this is a requirement. But you can add capacitance between the secondary ground and chassis.
There is also in general a Y-capacitor between the input GND and output GND.
I think at this point I am most concerned about that heatsink that you say is connected to chassis. What is on that heatsink?
Here is an appnote that may give you some idea. https://www.onsemi.com/pub/Collateral/AND8032-D.PDF