reccomendation for a glue which is both conducting heat and electricity

[yefj]

Hello,I Have the following PCB shown in the photo below ,which is glued on a heatsink.Is there a good glue you reccomend
which both conduct electricity and heat as best as possible?
Thanks.

 

[D.A.(Tony)Stewart]

There is more to cooling a junction than finding a supplier of TIM.
You must educate yourself on the entire process of every layer of thermal resistance, conductance, problems, process, best test methods, and testimonials.

I would be more concerned about how you remove the heat with forced water or air than just the TIM. My theoretical preference is a copper sponge for water cooling. (custom-made with very high heat flow)

Overclocking gurus prefer multiple materials to eliminate surface roughness voids.

https://www.coollaboratory.com/pdf/manual_liquid_metalpad_englisch.pdf uses Indium, copper and Bismuth alloy with special processes.

Thermal Interface Materials | Products by Indium Corporation

Indium Corporation is the leading manufacturer of thermal management materials and thermal interface materials worldwide. Contact us today.

www.indium.com

https://documents.indium.com/qdynamo/download.php?docid=1006

Something else may be better. Although suppliers may be biased, they are also better experts.

 

[FvM]

The thermal compound used on Wolfspeed demoboard (post #3 photo) looks much like indium-gallium liquid metal. According to safety data sheet, the compound isn't toxic and involves no health or enviromental risk. As it's commonly used for PC CPU overclocking, it's widely available (e.g. at a computer shop next door) and affordable.

If a specific application requires high peformance thermal compound is a different question.

 

[D.A.(Tony)Stewart]

Even if OSHA has it graded as a non-toxic for disposal to land-fill purposes, there are safety precautions.

https://www.sigmaaldrich.com/CA/en/sds/aldrich/495425?userType=anonymous

The micro-dimple pattern on the Cu might be an attempt to exceed 50% of the yield strain for a hermetic seal that was reported to improve thermal conductivity with adequate pressure to be better than grease.