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When potential process defects begin showing up underneath BGAs in electronic assemblies, there are numerous failure analysis tests that can be used to troubleshoot process problems.
In determining potential assembly defects at BGA locations. The first level of BGA failure analysis is visual...
There are generally two explanations
1. Digital Signal Process is a professional course of electronic information engineering, the main content is FFT, FIR, IIR, CIC.
2. Digital Signal Processor. DSP are similar to single-chip, ARM CPUs. There are instruction sets, ALUs, etc., and many...
In this series of articles, we will answer the questions that are frequently asked by our clients. And this Q&A 001 is mainly about our full-featured PCB relative services. You can also enjoy our video version below. We invite Daphne, customer service manager who has worked at PCBWay for over 6...
The chemical element symbol of nickel is Ni. Because of its excellent physical, mechanical, and chemical properties, nickel has many applications in engineering and industry, such as anti-corrosion, increased hardness, wear-resistance, and magnetism. It is mainly used in alloy formulations, such...
Hi all,
we design new wio project. In this project plan to design the 20 nos led indication. but available dimension of board is 5x45mm.
we had tried lot of method . But not placed the 20nos. For the reference here attached the image in this one we have placed 10nos.
kindly suggest...
The entire world is undergoing a crisis as a result of the persistent COVID-19 and we desperately require call mapping if we are to take up reliable actions against it. In this regard, MOKO supplies you with a variety of Moko Contact Tracing Wearables. These products are effective for call...
In our daily SMT soldering operations, we often find that ENIG surface-treated boards are prone to two fatal problems: nickel corrosion and phosphorus-rich layers. Once such problems occur, they often cause a lot of batch solder joint reliability problems. Because these two types of problems are...
Hi All,
I would like to share with you all my blogs on Physical Design Engineering. Presently it covers topics related to PnR flow starting from PD flow till Clock Tree Synthesis. I will keep posting other topics related to Physical Design in this blog. Please click below link to read further...
The Electroless Nickel Electroless Palladium Immersion Gold(ENEPIG) process is the earliest surface treatment process developed by Intel. By adding a palladium plating layer between nickel plating and pure gold plating, the nickel plating is separated from the gold plating layer to isolate the...
FITA offers the best Salesforce Training in Chennai by certified professionals from Various MNCs. Join hands with us to brighten up your future. We have opened various branches nearby you for Salesforce Training in Velachery. We are training more than 125+ IT courses for the salesforce...
As a PCB innovation company, PCBWay is committed to solving the pain points of PCB procurement and meeting customers' various PCB procurement needs - offering special plates such as Rogers, copper substrates, aluminum substrates, and high-frequency high-speed HDI.
Recently, with the efforts of...
Introduction
The tombstone phenomenon is that during welding process of the MLCC and PCB, one end of the MLCC leaves the welding area and is inclined or standing upright. The main reason is the unbalanced wetting force at both ends of the MLCC during the welding process. The main factors that...
PCB panel parameters
The primary reason for having your boards delivered in an array is to make automated assembly faster and less expensive. Running an array of boards through a pick-and-place machine is far more efficient than sending them through one at a time. Arrays are also desirable...
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