i want some clarification about tech file given with the software.
-- normally what i have seen that we refer λ as scalable parameter for sizing and generally use 2λ = X micron . but for o.5 micron tech file they wrote that λ = 0.30 micron for this process SCN3M_SUBM.
-- whats the difference between SCN3M_SUBM and SCN3M and SCNPC.
3M implies 3 metal layers are available, SUBM implies layout rules are revised so thatt it is uesful for submicron technologies. PC implies poly cap layer for linear capacitors is available.
Depending on the process there are other technology options such as 4M, 5M, DEEP(for deep submicron).