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What type material should be used in PCB ??

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kabaleevisu

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Hi everyone,
i need some clarification about PCB Selection Material.what are the type of PCB Material is available (in IPC Standard) ??
How to choose the PCB Material for Particular design Like Analog ,Digital ,High speed design and RF design ??
what are the property i need to consider while choosing the PCB Material in My design ? why ??
please any one reply for this queries
 

Dear Kapil,

I think for normal PCB, use FR4 is good.
But for the Analog ,Digital ,High speed design and RF design , it is better you use Rogers, Taconic,Arlon.
And some time even BT material from MITSUBISHI is essential.
Hope this is useful for you.

Best Regards
Leo Chou
Account Manager in Founding Circuits Company
 
Last edited by a moderator:

A transition material between low-cost FR4 (epoxy-fiberglass) and expensive Teflon [Rogers] is Polyamide (PA) looks like FR4 epoxy but with lower loss polyamide mixed in ( GETEK by GE is one brand).

PA is suitable for 1GHz and possibly more with specs. Loss tangent is 10x better at only 25% higher cost and slightly lower dielectric constant at 1GHz than rating at 100MHz is suitable for multi-layer.

There many other dielectric materials including high K "buried capacitance" for power & ground layers for distributed capacitance

... and aluminum substrate with printed copper and epoxy solder mask for power LEDs and MOSFETs

If you have IPC specs or supplier with conformance to IPC specs, be sure you follow all the design rules.

Every supplier has different price, quality and capability. All must be good.

Sometimes capability is split into 3 commercial categories ( outside R&D or military)

Product FeaturesStandardAdvancedMicroElectronics or HDI .00125" track&gap
PC Board Attributes
Min Layer count111
Max Layer Count2426+26+
Min Board Thickness.010".004".004"
Max Board Thickness.200".200" +.200" +
Min Core Thickness.002".002".002"
Min Dielectric.002".001".001"
Min. Starting Copper Foil Weight9 micron3 micron3 micron
Max. Finished Copper Thickness (O/L)6 oz> 6 oz.0015"
Max. Finished Copper Thickness (I/L)4 oz> 4 oz.001"
Maximum Panel Size21" x 29"21" x 29"12" x 18"
Minimum Panel Size12" x 18"12" x 18"8" x 8"
Smallest Mech Drill Diameter.0059".004".004"
Smallest Laser Drill Diameter.0030" / .0080".0025" / .0100".0025" / .0100"
Min Finished Hole Size.004".002"Plated shut
Max Thru Hole Aspect Ratio10:116:116:1
Max Blind Via Aspect Ratio.75:11.2:1.8:1
Blind Via Finished Hole Size.004"Plated shutPlated shut
Buried Via Finished Hole Size.004".002".002"
Minimum Line Width (trace) and Spacing.003".002".00125"
Min Pad Size for test.005".003".003"
Process Pad DiameterD + .012" (1 mil annular ring)D + .010" (Tangency)D + .006"
Stacked viasYesYesYes
Minimum Wire Bond Pad size> .006".004"0.0025"
Controlled Impedance Tolerance10%5%5%
Solder Mask Registration.002"<.002".002"
Solder Mask Feature Tolerance.001".001".001"
Solder Mask Min Dam Size.004".002".002"
Min. Diameter Rout Cutter Available.024".021".021"
Routed Part Size Tolerance.010"<.010"<.010"
Laser hole location Tolerance.0005".0005".0005"
Laser Routed Part Size Tolerance - can only be done with panels <.032" thick.001".001".001"
Bow & Twist Tolerance7%<7%<7%
Thickness Tolerance10%< 10%< 10%
Sequential Lam2 or less lam cycles> 3 lam cycles> 3 lam cycles
Buried Vias2 or less> 3> 3
Blind ViasYesYesYes
Conductive Filled ViasYesYesYes - Cu plate shut
Non Conductive Filled ViasYesYesYes
Surface Finishes
HASL (Vertical or Horizontal)YesYesNo
Lead Free HASLYesYesNo
OSP (Shikoku F2)YesYesYes
OSP (Entek)YesYesYes
ENIG (Electroless Nickel/Immersion Gold)YesYesYes
ENEPIG (Electroless Nickel-Electroless Paladium-Immersion Gold)YesYesYes
Immersion SilverYesYesYes
Tin NickelYesYesNo
Electrolytic Soft GoldYesYesYes
Electrolytic Hard GoldYesYesYes
Selective GoldYesYesYes
Solder Masks
Semi - Gloss GreenYesYesYes
Gloss GreenYesYesYes
Matte - GreenYesYesYes
BlackYesYesYes
RedYesYesYes
BlueYesYesYes
YellowYesYesYes
Legend
All colorsYesYesYes
Fab
Routed ArrayYesYesYes
V Score, Edge to Copper0.01"0.007"0.007"
V Score Angles35°,45°,60°35°,45°,60°35°,45°,60°
CountersinkYesYesYes
CounterboreYesYesYes
BevelYesYesYes
Milling+/- .003"+/- .003"+/- .001"
Edge CastellationYesYesYes
Edge PlatingYesYesYes
HeatsinksYesYesNo
Electrical Test
10 VoltYesYesYes
40 Volt (Burn in bds)YesYesYes
250 VoltNoYesYes
500 VoltNoYesYes
Hi PotNoYesNo
Laminate Materials
Very Thin FilmNoYesYes
Arlon 85NTYesYesNo
Hybrid ConstructionsYesYesYes
Isola FR406YesYesYes
Isola FR408YesYesYes
Isola IS410YesYesYes
Isola IS620NoYesNo
Isola P95YesYesYes
Isola P96YesYesYes
Matsushita R1766YesYesYes
Matsushita R1755YesYesNo
Matsushita MegtronYesYesNo
Nelco N4000-13 (SI)YesYesYes
Nelco N4000-6 FCYesYesYes
Nelco N4000-29YesYesNo
Neltec N7000-2YesYesYes
No Flow Pre PregYesYesYes
Polyclad PCL370HRYesYesYes
Polyclad GetekYesYesYes
PSA Bond FilmNoYesYes
Rogers 3000YesYesNo
Rogers R4003YesYesNo
Rogers R4350YesYesNo
Rogers 5880YesYesNo
Rogers 6000YesYesNo
Rogers TMMYesYesNo
Available Reports
MicrosectionYesYesYes
SolderabilityYesYesYes
X-ray FluorescenceYesYesYes
Ionic ContaminationYesYesYes
Time Domain Reflectometry test (TDR)YesYesYes
FAIYesYesYes
Certificate of Compliance (C of C)YesYesYes
 

Hi sunny,
Thanks for your reply.how can choose dielectrical material or core materiral depends on application ?? For analog and digital board or Power board material will be very right ?? so which factor should i follow to choosing dielectrical material for design (analog ,digital ,High speed more then 1 GHZ)
 

Deal kapil,
Generally speaking, FR-4 is ok, if multilayer board used high TG FR-4 is better(above 6L); For RF board ,if you board have microstrip filter or sensitive to characteristic impedance shoud use low dielectric loss materals like Rogers; For high speed design, if your PCB etch line not long, FR-4 is ok,Otherwise other depends on your simulation.
 

For most designs unless you are doing advanced more esoteric designs then a good grade of FR4 will suffice, with a suitable Tg rating. We rarely specify anything other than FR4,FR4 is good up to GHz range
 

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