mohamis288
Full Member level 3
I have a simple 2-layer PCB in 1 GHz frequency. I wish to provide a "MSUB" according to my design. even though I have studied carefully the ADS tutorial about this component, my questions about a couple of parameters exist yet.
The following link represent this tutorial:
ADS tutorial about "MSUB" component
I bring up the questions here:
1- As I mentioned before, I have a 2-layer microstrip PCB which the bottom one is the ground plane. I do not have any cover plane which is defined in parameters. So What value I choose for this?
2- This sentence is from this tutorial:
3- I do not understand what is "Diel2", "Cond2", "Res", and "Bond" parameters.
Can anyone answer this question?
The following link represent this tutorial:
ADS tutorial about "MSUB" component
I bring up the questions here:
1- As I mentioned before, I have a 2-layer microstrip PCB which the bottom one is the ground plane. I do not have any cover plane which is defined in parameters. So What value I choose for this?
2- This sentence is from this tutorial:
I do not know what does it mean? If these parameters do not affect the simulation, what is the reason to define them?Parameters Cond1, Cond2, Diel1, Diel2, Hole, and Res control the layer on which the Mask layers are drawn. These are layout-only parameters and are not used by the simulator.
3- I do not understand what is "Diel2", "Cond2", "Res", and "Bond" parameters.
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Can anyone answer this question?
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