Jan 28, 2013 #1 M manikanta.9332 Member level 3 Joined Mar 29, 2012 Messages 62 Helped 0 Reputation 0 Reaction score 0 Trophy points 1,286 Location Banglore Activity points 1,614 What is the meaning of pin assignment in floor planing? what happens there? Thanks....
Jan 28, 2013 #2 O OhaAmo Member level 4 Joined Mar 4, 2012 Messages 75 Helped 7 Reputation 14 Reaction score 7 Trophy points 1,288 Activity points 1,685 You put the pins in actual physical place in the boundaries of the module's floorplan.
Jan 29, 2013 #3 M manikanta.9332 Member level 3 Joined Mar 29, 2012 Messages 62 Helped 0 Reputation 0 Reaction score 0 Trophy points 1,286 Location Banglore Activity points 1,614 Thanks ......... what i am think is at the block level we are using the Pin assignment for the connecting the blocks but at the chip level what Happens.....
Thanks ......... what i am think is at the block level we are using the Pin assignment for the connecting the blocks but at the chip level what Happens.....
Jan 29, 2013 #4 vimalraj205 Member level 3 Joined Oct 11, 2011 Messages 65 Helped 16 Reputation 32 Reaction score 14 Trophy points 1,288 Activity points 1,670 HAI FRIEND in block level the pins are placed for the connection, in a chip level IO Pads are used for the connection to communicate
HAI FRIEND in block level the pins are placed for the connection, in a chip level IO Pads are used for the connection to communicate
Jan 29, 2013 #5 yadavvlsi Advanced Member level 3 Joined Nov 19, 2010 Messages 977 Helped 487 Reputation 972 Reaction score 459 Trophy points 1,343 Location Bangalore, India Activity points 6,991 At chip level it depends on the type of package. In flip chip, you have bumps and wirebond package, there are bond pads to connect to external world (PCB). https://en.wikipedia.org/wiki/Flip_chip https://en.wikipedia.org/wiki/Wire_bonding https://www.ti.com/sc/docs/package/guide.htm
At chip level it depends on the type of package. In flip chip, you have bumps and wirebond package, there are bond pads to connect to external world (PCB). https://en.wikipedia.org/wiki/Flip_chip https://en.wikipedia.org/wiki/Wire_bonding https://www.ti.com/sc/docs/package/guide.htm