The layers' structure ("the layout") from the design tape for the mask lithography has to be changed up to the requirements of the OPC (Optical Proximity Correction) necessary to create "correct" structures with dimensions in the order of the used "light" (EUV) wavelength or below.
This is achieved by complex and CPU-time-consuming computer calculations for the mask fabrication and exposure of the wafer thereafter.
I'd guess computational lithography refers to the development of appropriate computer programs and/or to the total processing of the layout on the tape-to-fab to the tape-to-masks.
I'd recommend to go on searching about OPC.