ridgemao1983
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www.onsemi.com/pub/Collateral/MBRB1045-D.PDF
The datasheet says:
Thermal Resistance Junction −to −Ambient (Note 2) is 68C/W
When mounted using minimum recommended pad size on FR −4 board.
The package is DPAK CASE 369C−01.
What does the "minimum recommended pad" mean? Does it mean I don't need to place thermal vias under the DPAK pad, so I can place other compoments just under the DPAK footpring on the other side of the PCB? And at this time, the thermal resistance is still 68C/W ?
thanks.
The datasheet says:
Thermal Resistance Junction −to −Ambient (Note 2) is 68C/W
When mounted using minimum recommended pad size on FR −4 board.
The package is DPAK CASE 369C−01.
What does the "minimum recommended pad" mean? Does it mean I don't need to place thermal vias under the DPAK pad, so I can place other compoments just under the DPAK footpring on the other side of the PCB? And at this time, the thermal resistance is still 68C/W ?
thanks.