Hi,
For your interest, if this board will go through mass production :
It is a good practice to put a small dot ( e.g. 1mm dia. ) near a multi pin component ( e.g. cpu ). The purpose is to let ' Pick and Paste ' machine set origin ( use laser beam ) so that all SMD components will put to right place with mininum offset.
To let this board pass through both reflow and wave solder machine, following design should be considered :
It's better to let all components ( SMD + through hole ) placing on same side of pcb while designing the board ( if possible ) .
Reason :
SMD components do not need to glue ( or use high melting point solder paste ) when passing through ' Pick and Paste ' machine and oven, otherwise :
i.) Some component may drop off, offset, mis-align etc ( because through hole component metal pins and SMD component are now on same side ) when pass through wave solder machine.
ii.) Touch up process also needed ( residue solder may causing short circuit between SMD compnent and metal pins )
Gluing smd component is a very time comsuming process and use of higher melting point solder paste is expensive.
From manufacturing point of view, it costs !
Roger