Wago 2060 series connector...pad sizes?

Page 5 of the following shows the land pattern for the wago 2060-4x2 series connector….It shows the mask opening on the big pad being more than 4mm long….
https://www.wago.com/infomaterial/pdf/51300133.pdf

However, the following wago 2060 series datasheet (On page 4) shows the mask opening on the bigger pad being exactly 4mm long.

https://www.farnell.com/datasheets/2059654.pdf?_ga=1.154383800.1679746183.1489787856

Do you know which one is right? (ie, 4mm or >4mm?)
Neither diagram actually shows how long the big pad is on the actual connector itself.

The "foot print" drawing doesn't give any clear information. Where do you see a reference to "mask opening"?

I see that Wago provides an Eagle library with various PCB terminal blocks. May be it clarifies what they want.

Where do you see a reference to "mask opening"?

Click to expand...

The gold bit of the pad must be a mask opening?...what else could it be?

- - - Updated - - -

https://www.farnell.com/datasheets/2059654.pdf?_ga=1.123974026.1679746183.1489787856

..on page 4 of the above, is the gold bit of the pads just the bit where the solder cream should go?....or is it the extent of the solder mask?

Sorry, but a foot print drawing that needs any kind of guesses like this is just crap.

Applying standard design rules it's clear that the connector landing pads should be larger than the pins, with respective solder mask opening, in case of doubt NSMD (non solder mask defined) style. 2 mm wide pads as suggested by the drawing seems a bit large because it will allow misalignment of the connector, but it's the most likely interpretation of the drawing, in lack of clearer information.

An experienced layouter will probably define the foot print according to his own experience if he gets the impression that the manufacturer is overchallenged with this job.

Based on years of experience with building components for ECAD libraries, I would say that the grey squares are the recommended lands for the connector. The soldermask opening would be landsize +0.1 mm ( soldermask ring of 0.05mm)

The orange squares are the contact areas where the pin hits the pad. have a look at the 3D model at

https://b2b.partcommunity.com/3d-cad-models/2060-452-998-404-smd-terminal-b-with-push-buttons-in-tape-and-reel-packing-pin-spacing-4-mm-0-157-in-2-pole-wago/?info=wago%2Fpg33%2Fserie2060%2F2060-0452_0999-0962.prj"


But these are just my two cents.

Do solder mask 1:1 using these in the past used the pads as shown on data sheet and as always I use a 1:1 solder mask as per IPC-7351 standard. Every pad should have a 1:1 solder mask opening, then the enlargement can be done at fabrication to match the board geometries and the manufacturers capabilities....

Hello,
I wish I’d read your posts before…I have now submitted the PCB for manufacture…still , its only 1 board to start with.
The attached shows how I did the footprint.
My solder mask opening is definitely oversized with respect to the actual pads on the part…..however, my solder mask opening is inside the recommended total pad area.
I wonder how the pick and place machine knows where the “centre” of the part is, and how its going to be able to smartly line up the part with my tight solder mask openings. My footprint does have a centre marker in it though, as on the attached pdf here.
My presumption is that they massively oversized the pads because it’s a bulky part and may rip them off if they were just “Minimum footprint” size pads. However, they are obviously worried about such a bulky connector sliding about on the pads during assembly, when the solder is hot, so I presume they want the small, tight solder mask opening to stop it slipping about. You can also see my solder cream area within the solder mask opening.

Here is the wago connector footprint again from wago datasheet (page 4)
https://www.farnell.com/datasheets/2059654.pdf?_ga=1.154383800.1679746183.1489787856