Both L and C are per unit length parameters in MLCC with many multiple layers required for large values. Depending on the geometry of the MLCC internal design, the ESL and C(parasitic) and assumptions of measurements with pad designs are not always predictable or linear.
Datasheets need to be verified, in case something is overlooked , like conductor surface roughness on u-wave path length and ground proximity effects or Er effects inside a shielded enclosure for u-strip, when transition rates are >> 1GHz.
Some dominant time domain relationships are;
τo=√(LC)=1/ωo, τ =L/DCR, Zo=√(L/C)
Thus small LC values are needed to reduce time delay.
Does it make more sense now to shrink component length with values for shrinking values for time delay,τo, while maintaining damping factor?
When precision is needed for high Q reactive components, low Er (NP0/C0G)) and air coils are used inside shielded boundaries with minimal pF.
The ratio of stored/load energy in closed loops is an important metric as the BW is a function of high Q resonance and phase abruptly shifts at centre.
Ripple is essential for feedback in order to sense and regulate output. It can never be eliminated.
The gain and ratio of impedances of load to source for all RLC parameters determines the attenuation of ripple and also cause of overshoot results.
Phase lead (type III) compensation is used to improve phase margin as well as ZVS , current feedback and other mechanisms.
Since power ratings also reduce with losses in smaller case sizes, and dissipation factors may be constant, multiple parallel C+ESR are benefitial to reducing ripple.
But don't get tied up in knots over it.