PCB Manufacturers or companies design rules may be quite different. I also don't know the involved technology, so I can't comment the particular case. I think that either copper-to-copper or solder mask rules are affected. There's a special point with same-net copper. Basically, same net copper-to-copper spacing is not absolutely required. But some people want to have a minimum same net spacing to get separated copper etched properly, even if it's same net. Otherwise, connect it by a trace.
Other design rules are related to solder mask. There are two cases. For tented vias, you want a minimum solder mask width to keep the via protected from process chemicals. Having the via annular ring completely covered with solder mask should comply with this requirement. For open vias, a minimum solder mask strip between pad and via copper must be kept to prevent solder drain. So if the via annular ring is completely exposed, 0.1 mm copper-to-copper may be too low.