hi
i tried loading the files but was not able to load them, till then you can just surf these links and books.....these will surely give you some idea about the DFM and second order effects......
Y. Chen, A. B. Kahng, G. Robins and A. Zelikovsky, “Practical Iterated Fill Synthesis for CMP Uniformity", Proc. Design Automation Conf., June 2000, pp. 671-674.
Zhan Chen and Israel Koren,” Layer Reassignment for Antenna Effect Minimization in 3-Layer Channel Routing” Proceedings of the Workshop on Defect and Fault-Tolerance in VLSI Systems (DFT),jan 1996,pp 77 – 85.
Jon Wilkening,” Grain Boundary Diffusion due to Stress and Electromigration”,
Courant Institute of Mathematical Sciences July 20,2004,pp 1 – 48.
Chin-Chi Teng, Yi-Kan Cheng, Elyse Rosenbaum, and Sung-Mo Kang,” Hierarchical
Electromigration Reliability Diagnosis for VLSI Interconnects”, journals of 33rd Design Automation Conference,las vagas,NV,USA 1996,pp 3 – 23.
Neil H.E. Weste & Kamran Eshraghian,”Principle of CMOS Design”,Pearson Education second Edition,2002,pp 109-464.
E.Fujishin,K.Garret,M.P.Louis,R.F.Motta, & M.D.Hartranft,”Optimized ESD protaction circuits for high speed MOS/VLSI,”IEEE proceedings of custom Integrated Circuits Conference,May 1984,pp. 569-573
Takayasu Sakurai,Kazutaka Nogami,Masakazu Kakumu,and Tetsuya lizuka,”Hot Carrier generation in submicrometer VLSI environment,”IEEE JSSG,vol.SC-20,no.2,Apr.1985,pp. 531-536