We're going to tape out in TSMC 2p4m 0.35 um process through MOSIS. May I know if anyone has experience in this process with MOSIS? If so, when you designed the circuitry, did you use the third-party PDK (NCSU PDK, for example) or the PDK from TSMC?
Usually 3rd party related stuff are NOT to be discussed owing to IP infringement/Copyright. For all these questions, I would recommend contacting directly the concerned firm.