Hi, jayanthi:
I think you should use layered polygons to describe everything including the patch, the ground and the probes etc. After you get the layered polygons, you are able to do anything you want. In fact, our importing capability is based upon layered polygons. You can import layered polygons and use them to build patches, grounds, probes and the vias. The process is automated on AGIF (Automatic Geometry to Ie3d Flow). AGIF allows a user to create IE3D models and perform streamlined simulations directly for a patch of GDSII files or cells from Cadence Virtuoso. It also allows users to create IE3D modesl including vias, solder balls and wire bonds from Cadence Allegro for PCB and Cadence APD for packaging. You are able to build complicated modesl directly from Cadence layouts without tedious manual operations. Regards.