cupoftea
Advanced Member level 6
Hi,
In pads standard, on my 4 layer board, I am getting thermal reliefs from my vias to the inner ground and power planes. These vias are not connecting to component pads…do you know why PADs standard is putting thermal reliefs here?, and how I can get rid of them?
In pads standard, on my 4 layer board, I am getting thermal reliefs from my vias to the inner ground and power planes. These vias are not connecting to component pads…do you know why PADs standard is putting thermal reliefs here?, and how I can get rid of them?