Super Thinner PCB board

[hunghung]

Dear all,

If a PCB board, 2 mils of core with 1oz copper at the top and bottom, is it a good board to be fabricated? will it be caused warpage during etching for inner layer process? if yes, what is the real factor caused to warpage? How to solve this problems?

For my understanding, if the thickness of copper is greater than thickness of core, when this board is being passed through the conveyor for etching, it will not withstand the energy of spray and heat and eventually caused to warpage.(is that truth?)

Best regards,
hunghung

 

[hw_guy]

2 mil dielectric thickness is extremely thin. If it is manufacturable, it will most likely be pushing the limits. You will probably get low yields because of this.

Warping is most commonly caused by some sort of asymmetric stackup (more plane layers on one half of the board or thicker dielectrics on one half of the board).