Thanks for all your help guys. I've tried with star grounding and with a 2mm thick aluminum casing for the switcher, but bit no success.
So, I'm redesigning the switcher. In the LT3755 datasheet it says
"To reduce electromagnetic interference (EMI), it is important to minimize the area of the high dV/dt switching node between the inductor, switch drain and anode of the
Schottky rectifier."
So I will try to minimize that area, but there is a problem. PowerPak, D2PAK, TO-220... packages have the drain terminal as a thermal pad, which is very large by itself. So, how can I minimize that area?
Thanks again!