Sprint layout SMD soldermask

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Synaps3

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I am pretty new to PCB layout. I am using sprint layout and I don't understand the difference between soldermask and SMD soldermask when I generate gerber files. The soldermask and SMD soldermask files seem to be the same. There is no through hole in my project.
 

There is no difference, soldermask is soldermask.

Try putting a PTH component on the board (temporary) and produce both then review them in GC-prevue and see if there is a difference.

Are you sure it's smd soldermask? (I don't know sprint itself)
There will be a soldermask (solder resist - the green stuff) which ALL components need and then there will be a SMD solder paste output for the SMD components - it may be this that your seeing.
 

I think you would see the difference if you'll compare PTH pad's solder mask with SMD pad's one. For example, my CAD software allows for different solder mask swell value for through-hole and SMD comps. I think Sprint layout should be similar.
 

All solder masks are best created using the guidelines in the IPC_7351 spec, 1:1 and let the PCB fabricator enlarge the mask to fit with his manufacturing requirements with the caveat that there is a solder dam between ALL pads.
 

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