The more I read the more I realize that my complex mixed-signal design with a sensitive Analog Front-End will be hurt by split grounds.
However, I would like to confirm it here If it worth it or not to split the grounds.
This is my internal ground plane on my 4-layer board. I will pour the ground planes on top and bottom copper layers as well and separate them in the same areas.
The 3 connections points between the digital ground and other grounds lay underneath mixed-signal ICs.
Overall, it looks like my analog and digital signal traces and the return paths are separated and do not cross the void copper of the ground planes. But my power rails, both analog and digital, cross the separation line between the grounds. I have seen some reference designs in AppNotes where power rails crossed the void copper lines. But, I am not sure if it is a good practice. I have 7 different supply rails for the output/feedback stage, so it is not possible to route without void copper area crossing a power trace/plane.
So, I have 3 options.
1. Split ground planes with power rails crossed by separation line (void copper).
2. The same as 1, but with jumpers on top and bottom to connect the ground planes if the system gets dirty, like Henry Otts suggested.
3. One ground plane for the whole board.
What do you think?