Sharing Pads between alternate components.

Hi..

I am modifying my layout such that a TCXO (IT7520BE) can be replaced by an alternate TCXO (DSB221SDM). These 2 TCXOs has totally different foot prints, but the pins representations are same.
I will use one of these TCXO in the Production level.
So I would like to come out with a design such that the 2nd TCXO will share the output pad with the 1st TCXO. I have attached the datasheets and the design i suggest as the attachments.
During the Production a common stencil file will be manufactured (for SMD process). in the case of mounting the 1st TCXO there will be a little amount of solder paste underneith the TCXO because i share the space with alternate TCXO.
does this is design is compatible? will it cause any problems? Please give your suggestions.

Hi,

for me it seems to be okay........... If you have more space available in your design just add these things as separate parts.

Looks workable, just fix the track coming out of pad 4 as its at an angle that leaves an acid trap.

Can you have both in the solder paste screen or will this mean you need a screen per part?
Because it may not be a good idea to have unconnected pads with paste on underneath the primary component.