1. Threshold voltage in a given technology depends on the gate insulator thickness & its dielectric constant. Lesser the thickness, less threshold voltage. There is a limitation in decreasing oxide as it will increase in gate leakage due to tunneling. It is a reliability issue. Threshold voltage is inversely proportional to dielectric constant. So with high-K material, we can have low threshold voltage, still having more thickness. Metal have very less resistance compared poly-Si. So there will not be any drop across the metal gate. This also will help in reduction of threshold voltage.
https://en.wikipedia.org/wiki/High-k_dielectric
https://en.wikipedia.org/wiki/Threshold_voltage
2. We see 90nm, 65nm, 45nm, 32nm, 22nm technology nodes.These technology nodes are decided by dividing the previous node by square root of 2. So that number of components remains the same even after reducing the area by a factor of 2 (because length is divided by square root of 2 so area will be divided by 2 ).
3. The main advantage of STI over LOCOS is area reduction. Another advantage is alignment tolerence reduction.
4. Variation of drain saturation current is more for 28nm tech.? This question is not clear to me. But drain current in 28nm drain is more. Drain current is
inversly proportional to channel length.
5. Copper has resistance to electromigration, the process by which a metal conductor changes shape under the influence of an electric current flowing through it and which eventually leads to the breaking of the conductor, is significantly better with copper than with aluminium. This improvement in electromigration resistance allows higher currents to flow through a given size copper conductor compared to aluminium. The combination of a modest increase in conductivity along with this improvement in electromigration resistance is to prove highly attractive.
6. Poly Space Effect: The distance between gates including dummy poly has a direct effect on the drain current of the transistor.Poly Space effect is the change in the saturation current of a MOS device due to presence of a poly near to the Gate.