antenna_abc
Member level 3
Hi, everyone. I have some questions about drawing buried vias connecting two conducting plates on a 4-layer PCB by using Protel DXP.
My questions are:
1. How can I define the buried via connecting ground plane and intermediate copper layer with square conducting patches on it? Actually it seems that I cannot directly place the via/hole on the PCB in Protel DXP.
2. How do I define different shapes of conducting patch in Protel DXP?
Thanks in advance.
My questions are:
1. How can I define the buried via connecting ground plane and intermediate copper layer with square conducting patches on it? Actually it seems that I cannot directly place the via/hole on the PCB in Protel DXP.
2. How do I define different shapes of conducting patch in Protel DXP?
Thanks in advance.