Janna13
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BSIM4 model files.1. What is level 54? I also see it in the *pm files.
Sure!2. If I need SF corner, does it make sense to take params for nmos from SS corner and for pmos from FF corner and combine to new *pm file?
Yes, of course. But you should be aware that the percentaged deviation depends on the process, and on the sigma value which is used for the percentage, and this in turn depends on how many sigmas away from the TT values your foundry will test and deliver.3. The "nano cmos" is only for bulk cmos, while I need it for low power cmos. Since I see the percentage of change in params between SS, FF and TT; does it make sense to apply the same percentage of change to params but in LP and this way build the LP model with process corners?
No, actually not. As long as you have no info about process and foundry, just use these percentaged values; they present good "mean values" for the speed deviations.... for now I don't really know the foundry or the process, do you have a better idea, how to find corners for LP?
Most people say the speed deviations (for the same sigma) grow at lower process sizes, but unfortunately I can't give you any values :-(2. I would like to check it also for lower then 32nm (this is the lowest in Nano CMOS), do you
think I can still use the same percentage of 32nm process but to apply it to 22nm and 16nm?
Don't forget to add voltage and temperature changes for your best/worst case analyses.
QUOTE]
Hello. I have a small question. Can we add Temperature info inside the model file?
Also,
I am using 45nm PTM models.
I have to make many different models with for CMOS with different operating condition. Starting from SS to FF. And I have to vary Vdd, Vthn, Vthp and Temperature for my analysis.
How should I vary these? Is Vdd most dominant? Does temperature have more effect then Vthn and Vthp?
What I thought was- I will Keep Vdd nominal, Temp nominal and generate TT, FF, SS, SF and FS. (5 models)
Then will vary Temp above and below nominal Vdd and generate TT, FF etc in each case. (5+5=10 models)
Same process I will repeat by lowering Vdd and increasing Vdd. (15+15)
and in the end- extreme conditions.
Is this the correct way?
... the question was- how to determine the value of Vths, Vdd and Temp variations? And which is the order of dominance? I believe Vdd is the most dominant. But not sure about others.
Thanks again.
1. Since I need to find corners for predictive model and for now I don't really know the foundry
or the process, do you have a better idea, how to find corners for LP?
2. I would like to check it also for lower then 32nm (this is the lowest in Nano CMOS), do you
think I can still use the same percentage of 32nm process but to apply it to 22nm and 16nm?
Again thanks a lot for your help, maybe I'll even understand it soon
These are quite different categories: There are Bulk CMOS and SOI CMOS processes. With both process categories, beside their standard process flow you may have options: High Speed CMOS with lower Vth, and Low Power CMOS with higher Vth than in the standard process flow.What is the difference between Bulk CMOS and Low Power CMOS?
Dear dhavalOveis,
The amount of variation is something you should try to seek from the industry. The professor with whom i was working got me some data from industry. dont know whether there is any other way to do so or not,. I am sure there must be a way out of it.
Such info is always confidential; all foundries disclose it only to customers after them signing an NDA.How could i find such information from Industry?
... Becaouse of some imposed constraints i think it could not gain these data from fabs.
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