PIC16F1947 land pattern doesnt tell of solder resist "stencil"

[treez]

Hi
PIC16F1947 TQFP (64 pin) datasheet gives top copper land pattern on page 453, but does not say where the solder resist mask should go.
Do you think a solder resist opening of 0.75mm all round each of the pads is acceptable? That only leaves 0.5mm for a solder resist “sliver” between the pads. Is that OK?


No PCB manufacturer/assembler gives any guidelines on this
https://www.eurocircuits.com/pcb-design-guidelines/

PIC16F1947 datasheet:
https://ww1.microchip.com/downloads/en/DeviceDoc/40001414E.pdf

 

[FvM]

Do you think a solder resist opening of 0.75mm all round each of the pads is acceptable? That only leaves 0.5mm for a solder resist “sliver” between the pads. Is that OK?

The numbers make no sense.

Industry standard is 50 um all round enlargement, 100 um minimal structure width.

 

[marce]

Re: PIC16F1947 land pattern doesnt tell of solder resist "stencil"

Use IPC-7351 rules, do solder mask same size as the pads, it can then me adjusted to fit the technology level of the PCB during manufacture, in some cases the over size can be zero for solder mask defined pads.

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Stencil.... stencils haven't been used since late 80's early 90's.... Photo-imageable.