PCB design references

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bhargav.611

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Hi guys,

Recently I was looking at one of the PCB design and in master drawing designer had mentioned about IPC and UL standards(IPC-6012 Class 2, UL 796, IPC 4552, IPC-SM-840, ).

Now When I looked on google for those standards, I found it is related to PCB manufacturing.

Can some one explain me what kind of standards a PCB designer should keep in mind while designing ?
Does it have to deal with design rule for PCB ?
Any reading or book on this references?

It would be great help if someone can guide me here.

Thanks in advance.
 

The IPC (Institute for Printed Circuits) is an association focusing on standardizing PCB design specifications, material specifications, inspection specifications as well as regulation of emerging technologies such as rigid flex PCBs etc. They are most commonly known for their guidelines regarding the size of pads for surface mount footprints.

However, in my personal experience, I usually give priority to the footprint advice (recommended pad layout, size etc) provided by the manufacturer when I'm making "exotic" footprints myself. For standard footprints (QFN, SOIC, TSSOP, ...) I use medium density footprints from standard footprint libraries.

Ultimately, it is the PCB manufacturer that decides how much clearance you must have between pads or tracks, how thick tracks must be etc.
 

See https://www.ipc.org/ContentPage.aspx?pageid=IPCs-Name

What standards you use can depend what market you are designing for.
Absolutely! The power levels and environment that it will be used in affect those decisions. For high power you can start with a standard 2 oz of copper per square foot and plate on up to 8 ounces more(maybe more these days) and have through holes plated as well. The environment would affect what board material you need to use. I forgot most of that environmental stuff but there are different compounds for moisture, vibration and flame resistance.
The design requirements for the pcb determine the spacing between traces not the PCB manufacturer. If they have the skills the gaps can be really small. One computer manufacturer runs ultra small traces and gaps all the time and timing during the etching process is critical. Some spaces are less than 10 microns.
 
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Regularly do 10 micron designs, its common these days. As to base material FR4, very rarely do designs require anything but FR4... If you join the IPC you can access their yearly report on PCBs this includes the percentage breakdown of PCB base laminate material used... mainly FR4.
Familiarising oneself with IEC-60950 (creepage and clearance distances) would be another benefit....
 
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