Parameters to decide DIE bump/pad Pitch

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prasguy

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Hi All,

On what parameters Wirebond and Flipchip Die bump pitch are decided?
I have seen most of the WB die pitch has min of 50um and FC Die has 180um .
Would like to know on what standard it has been placed? Whether PD engineers aware of Packaging layout?

Thanks for the time.
 

You are speaking about so called SIP: System In Package I guess.
I think that there is no standard, technology engineers do it in a way that it function.
There are also issues of crosstalk, may be there is relation with this topic.
Regards
 
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The pitch could be limited by the PCB maker.
For one project, the customer request bigger pitch to be able to used a low cost PCB maker.
TSMC provide rule for bump placement.

- - - Updated - - -

using Wirebond or bump is dependant of the targeted package(s).
 

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