tewasch
Newbie level 1
I'm designing a PADs footprint for a microwave stripline filter. I need to make many of these at different frequencies so I'm trying to come up with an easily editable base filter. The 3-layer construction has full copper ground planes on top and bottom and the middle layer has a very-precise layout. A 600mil x 200mil example with 20.2 mil traces is shown...
I'm researching the best way to do this in PADs. From a DC-point of view, all vias are shorted together, but from an RF point of view, the input comes in on via1 and leaves on via2 and all other vias are connected to the RF ground plane (above and below).
Because I need very precise dimensions (fractions of mils), I've drawn this with individual "pads" (using pad stacks) as all geometries (hence every geometry has a number). By editing 17 pad stacks' X,Y location and size, this geometry will re-draw itself. I use an excel spreadsheet to compute the parameters I need. I expect only to use pins 1 (input), 2 (output) and 3 (gnd) on the schematic. When I draw the top/bottom copper area (for RF grounds) I want them to be connected to vias 11, 12, 13, 14 and 15.
When I do this pour, how to I get the 5 RF vias to connect to the ground fill while not connecting to the RF input/output vias 1 & 2?
Any other suggestions on how to build very precise multi-layer geometries in PADS footprints would be appreciated. Thanks all.
I'm researching the best way to do this in PADs. From a DC-point of view, all vias are shorted together, but from an RF point of view, the input comes in on via1 and leaves on via2 and all other vias are connected to the RF ground plane (above and below).
Because I need very precise dimensions (fractions of mils), I've drawn this with individual "pads" (using pad stacks) as all geometries (hence every geometry has a number). By editing 17 pad stacks' X,Y location and size, this geometry will re-draw itself. I use an excel spreadsheet to compute the parameters I need. I expect only to use pins 1 (input), 2 (output) and 3 (gnd) on the schematic. When I draw the top/bottom copper area (for RF grounds) I want them to be connected to vias 11, 12, 13, 14 and 15.
When I do this pour, how to I get the 5 RF vias to connect to the ground fill while not connecting to the RF input/output vias 1 & 2?
Any other suggestions on how to build very precise multi-layer geometries in PADS footprints would be appreciated. Thanks all.
