No, but it would thwart safety qualification.Also, does the spark gap prevent damage to the innoswitch
Never.Would it be Ok for us to put the spark gap on an inner layer?
You know?I know its greater distance for the flashover on inner layers,
As a general rule-of-thumb, the dielectric strength of an epoxy is roughly 500 volts/ mil at 23°C for an insulating product. As a practical example, if an electronic circuit needs to resist 1000 volts, a minimum of 2 mil of dielectric epoxy is required.
Thanks, in that sense concerning spark gaps, i tend to agree with yourself.All in all: it´s so unreliable, thus for me no option.
Introducing a spark gap on your board prevents damage to the InnoSwitch device during Hipot testing, as the energy that would normally pass through the device will instead pass through the spark gap. However, this does not guarantee that your entire system will pass the Hipot test. Our InnoSwitch3-CE is tested to withstand Hipot testing up to 4 kV.
Not at all. Pg 138 isn't talking about conductor spacing, only voltage rating (test voltages).Pg 138 of EN61010 as below states that for CAT IV (overvoltage), the creepage and clearance values are exactly the same
for inner PCB layers as outer PCB layers
Creepage doesn't exist on inner layers, the term clearance is however used for internal conductor distance in some standards, e.g. IPC 2221A. IEC 61010 avoids it for inner layers.I don´t think that "creepage" is valid terminology for inner layers. It needs a surface (to get dirty with time) and air on the opposite.
I also don´t think "clearance" is valid terminology for inner layers, because it also needs "air".
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