kwagjj
Member level 1
I'm not sure if this is the right forum but it looked like the one most related to my issue
I'm asking about the 'hardware' of the pcb actually and I thought that most of you might have some experience with this as well as the software side of pcb design.
I asked the vendor about the 4 layer pcb layer info so that I could simulate it.
I received a figure like this:
I figured out what the 'oz' and 'C/F' 'C/L' 'P/P' means.
But there are some things that are unclear to me
1. could there be a special reason for the prepreg(P/P) to be expressed in two layers?(as in 0.18T/0.11T adding up to 0.29mm in thickness). Is it just a common process to use two layers for pregreg?
2. At the bottom of this figure(not shown in the image) the vendor stated that the material of the pcb is Fr-4. Then does this mean that the Core laminate(C/L) and the pregre(P/P) both are FR-4??
I'm asking about the 'hardware' of the pcb actually and I thought that most of you might have some experience with this as well as the software side of pcb design.
I asked the vendor about the 4 layer pcb layer info so that I could simulate it.
I received a figure like this:
I figured out what the 'oz' and 'C/F' 'C/L' 'P/P' means.
But there are some things that are unclear to me
1. could there be a special reason for the prepreg(P/P) to be expressed in two layers?(as in 0.18T/0.11T adding up to 0.29mm in thickness). Is it just a common process to use two layers for pregreg?
2. At the bottom of this figure(not shown in the image) the vendor stated that the material of the pcb is Fr-4. Then does this mean that the Core laminate(C/L) and the pregre(P/P) both are FR-4??