mfd
Newbie level 4
Hello,
I'm new at this. I need to find out the proper way to split a layer with dual power planes. I want to do a 4 layer PCB:
L1 - signal traces
L2 - Split layer with 5V and 3.0V planes
L3 - ground
L4 - signal traces.
The components using 3.3 or 3 are all over the board so the 2 options I was thinking are:
1- Do 2 comb shaped power planes interleaving each other. This is would be a kind of a symmetrical layout.
2 -Do it like connecting traces from components' pads to pads using wide traces.
Or if there's a better way to do it I would appreciate to know.
Thanks in advance. Regards,
Mario
I'm new at this. I need to find out the proper way to split a layer with dual power planes. I want to do a 4 layer PCB:
L1 - signal traces
L2 - Split layer with 5V and 3.0V planes
L3 - ground
L4 - signal traces.
The components using 3.3 or 3 are all over the board so the 2 options I was thinking are:
1- Do 2 comb shaped power planes interleaving each other. This is would be a kind of a symmetrical layout.
2 -Do it like connecting traces from components' pads to pads using wide traces.
Or if there's a better way to do it I would appreciate to know.
Thanks in advance. Regards,
Mario