Fundamental Electrical concepts
PCB materials and manufacturing process
Component Identification and assembly line
High-speed board design issues
PCB design for reduced EMI and SI issues
Distinctive features
Well-structured Theory and laboratory sessions to gain experience of practical situations in
High Speed Board Design for various applications
Collaboration with leading industry for PCB Fabrication exposure and Assembly line exposure
Working with the professional VLSI CAD tools from CADENCE
Guest lectures, seminars and case studies by experts from leading industries
Curriculum
Theory:
Introduction to PCB Design:
Brief History, Trends in PCB , Component Identification ,Types of Circuits ,Circuit flow ,Multilayer Boards, Basic
Manufacturing Requirements.
PCB Layout:
Pre-Design preparation ,Pad Stack, Footprit Design,Interface with mechanical team, DXF Files, Component
placement , Sectional , Flow, Setting up design rules, Back annotation, Design Partitioning, Addressing DFM , DFT,
DFA issues.
Thermal Issues:
Thermal issues ,Power& VCC Planes, Split Planes , Guard rails, Grounded Heat sinks, Reuse modules, IPC/UL
Standards .
EMI/EMC & Signal Integrity:
EMI/EMC issues:
Sheilding Ground Loops , Emissions ,RF Energy & Parasitic, Routing Topology, Layer Stack up, Decoupling & bypassing
Signal Integrity:
Refection & Transmission Lines, Cross Talk,
Differential Traces, Impedance matching, Ground Bounce, Power
Decoupling & Bypassing
Design Outputs:
Gerber files,NC Drill & NC Route files / Output for pick & Place Machines, Types of Materials for PCB,
Demonstrating & Explaining process for DS / Multilayer PCBs
Visit to Manufacturing unit
Visit to Fabrication unit
Lab Sessions
( Tool Used: Cadence Allegro Platform)
Component Identification, Schematic Entry
Pad Design , Footprint Design ,Generating Netlist
Component Placement , Design constraints, Routing
Copper pouring , DRC & Reports, Reuse Module,
Gerber Output
Assignment: Complete front to back design flow