swen_s
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I would need advice in deciding what PCB stackup to use for my project.
I have two voltages (5V and 3.3V) and some LVDS (differential signals).
Is this a good stackup?
Layer 1: Components, small routing near ICs. I have also some signals that need to be 100 ohm (differential impedance). These I would like to route on the top layer to avoid using vias on these signals. The differential signals cut through the whole top layer and makes it impossible to route other signals in that area.
Layer 2: GND (to be able to route microstrips on the top layer)
Layer 3: X routing
Layer 4: GND (this is a shared plane for the X and Y routing)
Layer 5: Y routing
Layer 6: 3.3V
Layer 7: 5V
Layer 8: Components and small routing near ICs.
I have two voltages (5V and 3.3V) and some LVDS (differential signals).
Is this a good stackup?
Layer 1: Components, small routing near ICs. I have also some signals that need to be 100 ohm (differential impedance). These I would like to route on the top layer to avoid using vias on these signals. The differential signals cut through the whole top layer and makes it impossible to route other signals in that area.
Layer 2: GND (to be able to route microstrips on the top layer)
Layer 3: X routing
Layer 4: GND (this is a shared plane for the X and Y routing)
Layer 5: Y routing
Layer 6: 3.3V
Layer 7: 5V
Layer 8: Components and small routing near ICs.