My pcb layout, any suggestion?

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zsuhh

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top layer:


bottom layer:
 
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Seems as clearance defined to ground plane is quite small, particularly close to components Pads, which eventually could have a solder drop spreading beyond their unmasked region.




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Hi,

Thermals are switched off. This makes soldering by hand difficult.

Klaus
 

1\Shape thermal relief orthogonally connects to SMT pins, through pins, that would be best;
2\Shape clearance in the range of 0.3~0.5MM is perfect;
3\you can use thick lines, big vias. to save costs
 
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    zsuhh

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The clearance is 6 mil between lines and shapes. For soldering, it is no problem. I have soldered a lot this kind of boards by hand.
 

zsuhh said:
The clearance is 6 mil between lines and shapes. For soldering, it is no problem. I have soldered a lot this kind of boards by hand.
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Thermals are the gaps to the signal plane connections. You don't use it. Be sure this is what you want.

Klaus
 
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    zsuhh

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Hi guys, thank you so much.

I have changed the design as folllows;
(1) Thermal relief connect setting: Thru pins: Diagonal; Smd pins : Orthogonal; Vias: Full contact;
(2) I have checked the BBB design. It's clearance between lines and shape is 5mil. So I might keep mine as 6mil.
(3) The line's and visa's size already match the pcb factory's minimal requirement. If I increase them, it still not save money. Anyway, still thank rube so much for your valuable suggestion.
 

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