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MOUNTING OF SMD COMPONENTS IN RF CIRCUITS (MICs)

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abhityagi85

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Hi everybody, This is abhinav, working on rf frontend for sdr
i have a querry regarding mounting of smd components on substrate. how should i do mounting??????? is it different from normal mounting of DIP packages??? if someone can send ur feedback and links related to mounting at abhityagi85@gmail.com i shall be greatly thankful.
:)
 

**broken link removed**

Instead of the toaster I'm using hot air. I've soldered SMD and TQFP running up to 5GHz. Will not work from the first try...
 

Soldering SMD components are very difficult and one must need a very good hands on experience experience. Mounting and removing of the component is very difficult. It took 4 years for me to learn the actual soldering of SMD components. For SMD soldering you should always use a temperature control soldering iron and the temperature should not be more than 200 - 250 deg. Only thing never heat the for more amount of time as they will break. just take lead at the tip of the iron. add flux in a very very little quantity, just touch the soldering pad where the component is placed for just 2 or 3 sec. While doing this hold the component with proper tools so that they do not shake while soldering.
 

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