It IS a real issue. the substrate you use has a dielectric constant that is specified IN A RANGE of values. There are also etch tolerances one has to live with.
For truly critical filter designs, i have seen people come up with perhaps four different mask sets (each with elements a little longer than the previous one). They make sure all the substrates are from the SAME MANUFACTURING LOT. They print on a filter on one substrate, and if the corner frequency is off, they chose another of the mask sets. When they finally find the correct mask set for that one lot of substrates, they then manufacture the entire production run.
It was explained to me once this way: "Kyocera takes a kiln the size of a train car, puts it into the oven, and fires all the substrates at the same time. Some get more heat, some get less heat. They throw out the ones that are way off for dimension or dielectric constant. but they sell you the rest!"
A better method is to do a proper SYSTEM DESIGN so you do not rely on such high tolerance filters. Maybe you can make up for variations in the IF section of a receiver with RF filters, for instance. Or at baseband using FFT filtering. One might need to overdesign compression points and IP3 in a reciever to allow for such spread out filtering to work.