Sherry1
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I have BGA package IC with pitch 0.4mm and pad size of 0.23mm. Very tightly integrated!
I can not use fan out arrangement as the Pad-pad and pad-track distance becomes <0.1mm which is unacceptable for manufacturer for Copper = 1 oz.
Can I put a Micro via on the BGA pin pad( going from top layer to the next internal PCB layer) ??
PCB thickness: 1mm
I can not use fan out arrangement as the Pad-pad and pad-track distance becomes <0.1mm which is unacceptable for manufacturer for Copper = 1 oz.
Can I put a Micro via on the BGA pin pad( going from top layer to the next internal PCB layer) ??
PCB thickness: 1mm