Catalin_C
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Hi guys,
I'm interested in your opinion in this interesting matter I'm discussing with my friends.
For a deep submicron technology, in analog layout, what metals would you prefer to route a matching structure?
Would you go for the higher metals which offer the lower capacitance(but could induce mechanical stress because of the multiple via over the drain or source diffusion), or route with lower metals?
Do you usually route using simmetrical metal structures over the active gate? Because in the end it will be metal filled anyway and may affect the matching even worse than simmetrical routing.
Any experienced analog deep micron layouters out there?
Thank you!
I'm interested in your opinion in this interesting matter I'm discussing with my friends.
For a deep submicron technology, in analog layout, what metals would you prefer to route a matching structure?
Would you go for the higher metals which offer the lower capacitance(but could induce mechanical stress because of the multiple via over the drain or source diffusion), or route with lower metals?
Do you usually route using simmetrical metal structures over the active gate? Because in the end it will be metal filled anyway and may affect the matching even worse than simmetrical routing.
Any experienced analog deep micron layouters out there?
Thank you!