Lithography friendly Design:
With designers adopting innovative ways of design for manufacturing (DFM) techniques
with the sole motive of improving yield, what is required is to close the gap between the
process and design. Instead of a post processing of the GDSII file, there has to be
continuous awareness of the process window at all stages of deign flow. If the designer is
aware of the distortions that might happen, own distortions can be added in the opposite
direction such that both nullify each other.
In OPC, the GDSII file is modified by changing the existing features or adding new
features, known as sub-resolution assist features to obtain better printability. Complex
series of steps which the fabs undertake are modeled to ensure the printed design is
comparable to the targeted one. This process is usually undertaken post layout ::!::!::!::!:
thanx.