LGA-12 footprint design

[rfdesign1]

I would be grateful if some experienced designers could evaluate the attached proposed footprint design and provide any feedback. I've had trouble with similar packages in the past. Not sure if it was the footprint design, pcb fabricator, or the assembly house.

The footprint details I am planning on using are at the bottom of the pdf attachment.

Forgive me for using inches on a metric 2mm x 2mm part.

Thank you much,
Dave

 

[KlausST]

Hi,

I've had trouble with similar packages in the past.

What trouble?

Klaus

 

[rfdesign1]

Hi,


What trouble?

Klaus

Klaus,
About 10% of the circuits built with a similar IC that this will replace have had a failure related to processor communication with the part. I've asked for x-ray analysis from the factory and buzzed out failed PCBAs, but no obvious answers yet.
-Dave

 

[KlausST]

Hi,

You talk about soldering problems?
False disconnect?

Klaus

 

[rfdesign1]

IC fails to respond to any comm via SPI bus. Signals into IC are good. Nothing ruled out at this point.

Do you know if the copper, soldermask, and paste pattern shown in original post is good?

-Dave