Robertt
Junior Member level 3
I designed a pll chip and did the post layout simulation. the result gave me 0.5W total power dissipation. The peak power can reach 1 W.
Is that too large to burn the chip after fabrication?
I have no idea. I never taped out before. Please give me some idea. Thanks a million.
The process is Ami 0.5u. and the die are is 1*1 sqr um.
Robert
Is that too large to burn the chip after fabrication?
I have no idea. I never taped out before. Please give me some idea. Thanks a million.
The process is Ami 0.5u. and the die are is 1*1 sqr um.
Robert