leolib2004
Junior Member level 3
Hi,
I am going to pay for some board house to do the assembly as the process will be safer if I do so and I would like to know if the glue layer is actually needed. It's going to be Advanced Circuits and the only requirement they state in their site is the Cream layer which I have already provided.
I have asked about the glue layer but they haven't told me anything useful of it: Just add a note in the "assembly notes" file. It seems that they don't need it but I think it can be better to have it in order to secure the components to the board.
I have checked in Eagle and the libraries practically don't use it and the only place I've seen it is for resistors and capacitors.
Is it really needed for them and for a LQFP-100, DFN16, QFN32 and a wifi module? It is a reflow oven.
It seems to me that it's something that they should do automatically and I am not really sure how much glue I would need. It seems to be like drops of glue but, do they follow a pattern?
Thanks in advance.
I am going to pay for some board house to do the assembly as the process will be safer if I do so and I would like to know if the glue layer is actually needed. It's going to be Advanced Circuits and the only requirement they state in their site is the Cream layer which I have already provided.
I have asked about the glue layer but they haven't told me anything useful of it: Just add a note in the "assembly notes" file. It seems that they don't need it but I think it can be better to have it in order to secure the components to the board.
I have checked in Eagle and the libraries practically don't use it and the only place I've seen it is for resistors and capacitors.
Is it really needed for them and for a LQFP-100, DFN16, QFN32 and a wifi module? It is a reflow oven.
It seems to me that it's something that they should do automatically and I am not really sure how much glue I would need. It seems to be like drops of glue but, do they follow a pattern?
Thanks in advance.