cshah7
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Hi,
Can anyone please help me for finding out the Inductance between two parallel cylindrical Through Silicon Vias used for 3-D Integration using HFSS?
The condition is that the flow of current through the TSV is in opposit direction and the dielectric separating them is Silicon substrate.
Can anyone please help me for finding out the Inductance between two parallel cylindrical Through Silicon Vias used for 3-D Integration using HFSS?
The condition is that the flow of current through the TSV is in opposit direction and the dielectric separating them is Silicon substrate.