giorgos3924
Junior Member level 2
Hello!
I designing a pcb in an application which need to have HSPA module, GNSS module (and WiFi perhaps).
Due to designing complexity i thinking if i may have fixed impedance traces on 50 Ohms only in necessary areas.
This is for exploitation of 4 layers as signal layers. And without to reserve 2 layer (of 4) as planes.
On 4 layer PCB:
Signal 1
Signal 2
Signal 3
Signal 4
I thinking that this is could be with GND polygon pour below microstrip line.
for example: microstrip line on Signal 1 and GND polygon pour below that, on Signal 2.
Widths of micro-strip lines should be calculated with Calculators depending on dielectric, PCB, and cooper thicknesses.
Is my consideration proper?
Or instead of micro-strip technique, it could be a coplanar microstrip with grounded polygon pour below and adjacent.
Thank you!
I designing a pcb in an application which need to have HSPA module, GNSS module (and WiFi perhaps).
Due to designing complexity i thinking if i may have fixed impedance traces on 50 Ohms only in necessary areas.
This is for exploitation of 4 layers as signal layers. And without to reserve 2 layer (of 4) as planes.
On 4 layer PCB:
Signal 1
Signal 2
Signal 3
Signal 4
I thinking that this is could be with GND polygon pour below microstrip line.
for example: microstrip line on Signal 1 and GND polygon pour below that, on Signal 2.
Widths of micro-strip lines should be calculated with Calculators depending on dielectric, PCB, and cooper thicknesses.
Is my consideration proper?
Or instead of micro-strip technique, it could be a coplanar microstrip with grounded polygon pour below and adjacent.
Thank you!