giggs11
Member level 3
Hi guys,
Does anyone know to specify the desired number of vias for interlayer connection in Tanner SPR.
Consider a case where only one via is assigned for the interlayer connection between M1 and M2 and the current conducted by the metals exceed the via's conduction capacity.
One usually assigns more than one via should the current be large. But what happens when not enough vias are drawn at a metal line conducting large current of 2 to 4mA; does the via breakdown or does it just slow down the current transfer activity or limit the current transfer?
From my observation, Tanner SPR layouts do not take into account the current density and only assign one via for all interlayer metal connections.
Appreciate the help,
Thanks.
Does anyone know to specify the desired number of vias for interlayer connection in Tanner SPR.
Consider a case where only one via is assigned for the interlayer connection between M1 and M2 and the current conducted by the metals exceed the via's conduction capacity.
One usually assigns more than one via should the current be large. But what happens when not enough vias are drawn at a metal line conducting large current of 2 to 4mA; does the via breakdown or does it just slow down the current transfer activity or limit the current transfer?
From my observation, Tanner SPR layouts do not take into account the current density and only assign one via for all interlayer metal connections.
Appreciate the help,
Thanks.