Alex Liao
Member level 4
Hi,
For Layout dependent effect (LDE), the STI(Shallow Trench Isolation) is a big issue. If you do a simulation in advanced technology nodes, say, tsmc65nm or even 20nm, how can you tell whether you have reflected this STI in your simulation or what is the extend of SIT effect exposed in this simulation. I find there is no way to see if it is good or bad in terms of STI consideration in simulation until finally you have your design taped out and circuit manufactured. Then finally test of the real circuit may give you some clue. But even then, the reasons causing a chip not working are many. Any failure at this stage could not only be ascribed to STI. Anybody has any clue on how to reflect STI effect in a simulation? Your knowledge presented here would be highly appreciated.
Thanks,
Alex
For Layout dependent effect (LDE), the STI(Shallow Trench Isolation) is a big issue. If you do a simulation in advanced technology nodes, say, tsmc65nm or even 20nm, how can you tell whether you have reflected this STI in your simulation or what is the extend of SIT effect exposed in this simulation. I find there is no way to see if it is good or bad in terms of STI consideration in simulation until finally you have your design taped out and circuit manufactured. Then finally test of the real circuit may give you some clue. But even then, the reasons causing a chip not working are many. Any failure at this stage could not only be ascribed to STI. Anybody has any clue on how to reflect STI effect in a simulation? Your knowledge presented here would be highly appreciated.
Thanks,
Alex