Yes, ports are among the most important EM topics and it is amazing how few tutorials are published on the underlying concepts. The choice of ground reference for the port is important, and port calibration can also be an issue.
What is your application? For Momentum, I have published a few RFIC/MMIC port appnotes here:
https://muehlhaus.com/support/ads-application-notes/momentum-port-global-ground-or-differential
https://muehlhaus.com/support/ads-application-notes/inductor-em-ports
https://muehlhaus.com/support/ads-application-notes/em_line_ground
https://muehlhaus.com/support/ads-application-notes/edge-area-pins
a) +P1 -GND (default ideal ground)
2) What could I did wrong to make case a) producing highly unphysical result?
Hi Sherry,
I had a quick look at your model and these issues:
1. The port setup looks wrong/unexpected for CPW. You have added some extra metal near the pins, and then placed the pins inside the metal. This means that you can't use port calibration. Is this to imitate the measured hardware, or any other reason why you created the pins/ports that way? Usually, I would define a proper edge for all signal and return conductors, and place the ports at that edge.
2. Related to 1: it seems that you compare to measurements. How did you feed the hardware in measurement? If we know that, we can use a similar way (more or less) of feeding in Momentum.
3. You have NOT used edge mesh. For accurate results with such lines, edge mesh is highly recommended.
4. You have used mesh reduction. For most accurate results, I would switch it off. It might create an asymmetric mesh for your symmetric layout. Let's play it safe and switch off mesh reduction for this case.
I will look in more detail, and prepare a model for you which I consider accurate. What ADS version do you use?
Regards
Volker
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This case can't work because there is no physical return path. Your CPW ground isn't connected at all, and there is not infinite ground plane in the substrate definition either. With an infinite ground, Momentum would automatically place the port reference at the nearest infinite ground location. Without such infinite ground, you must manually provide an explicit ground reference that is physically close to the signal pin. Otherwise, results will make no sense.
1. The extra piece of metals were in the layout when I got the file. I think it corresponds to the actual shape of the fabricated board. There are two pieces of ground/copper stick out in the lateral direction so that the SMA connectors won't short all metal layers in the board.
3,4 Thanks for your insightful suggestion, I left everything as default because I didn't know what should I touch.
5) Regarding the default ground, I understand it's causing problem and I can do an easy fix in this case, but I have some question for another design I've encountered. So I had a 4 layer board, and none of the layers is a solid ground plane, so I realized I have to use the theoretical infinity ground. Then I worry about the accuracy of my result. In this case, is there any other way I can setup the port to avoid using the theoretical ground?
Hi Sherry,
The individual S-parameters (port referenced to ground at infinity) will be invalid then, but you will get useful results as soon as you assign another physical pin as the explicit ground reference. This can be done on the port settings, and you had already use that option. If you had already done/tried that in your "strange results" case, I would suspect that you mixed up pin numbers and assigned wrong reference pins (physically far away from the signal pin).
Archived ADS2014 workspace is attached.
Just wondering, did you attached the modified workspace? I wanna see how you played with the schematic, but I don't see the attachment from my end.
Sorry, it wasn't attached. Here it is.
1) When I place the ports slightly inside, not at the edge of the small rectangles, the amplitude of S11 is lower and matches better with measurement. Do you think this make sense? I realize the SMA is in contact with the board for about 5mm long from the edge toward the middle, so I suppose it's hard to say whether the excitation is at the edge or the tip of SMA connector.
2) I turned on the edge mesh and turned off the mesh reduction, and it makes the result match better with the measurement. I see there's also a transmission line mesh, and it'll make denser mesh on the signal line. When should I use that?
Hi Sherry!
Makes sense to me ... the connection through the extra metal strip for the side grounds is inductive, and if we add solid solder connection, we reduce inductance, which helps to improve the matching.
For coupled lines (signal and ground in the CPW) most the capacitive charge goes to the edges (gap). We want to have fine mesh there, so that the solver can place the charge at the gap. That's exactly what edge mesh gives us: fine mesh along the conductor edges.
I have not much experience with transmission line mesh in Momentum, but from my experience with other tools and from looking at the current densities for lines, I would think that edge mesh is the better choice in most cases (where line width >> skin depth).
some issue with S21, the simulated value is always higher than the measured value.
Not sure if "higher" refers to transmission, or insertion loss? Do you mean the measurement has more loss?
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When I looked for the roughness value of the RO4003 copper foil, to include it in simulation, I noticed that Rogers only offers 18µm, 35µm and 70µm coper foil thickness. What is the 52.5um thickness that you mentioned - any extra metals like nickel/gold on top of the copper?
Um...I'm not sure if I understood it correctly, I thought RO4003 is the dielectric, and the copper is on top of the Rogers material, not inside.
The copper trace is 1.5oz, which translates to 52.5um. I don't think there's other metal on top of it.
Sure, it is on top. I'm just surprised by the 1.5oz because in the Rogers documentation there is no such metalization option. They have listed 1/2oz, 1oz and 2oz only.
I had simulated with 3.2µm RMS roughness for the bottom side of the conductor, which caused an increase in insertion loss of ~ 0.05dB at 5GHz for your line.
Ok, fine. I was thinking that you might have Nickel/Gold passivation on top, which is known to increase the losses.
Oh...I always ignored the copper surface roughness
I looked at the table you attached, and don't quite understand the first column, how do I know which foil type my board is using? Should the PCB vendor have the info or is there something general I can assume?
Same for me :wink:
I only included it here, because the software can do it, and we are looking for sources of extra loss.
There are two main kinds of copper metalization that Rogers offers: smooth (rolled) copper and electrodeposited (rough) coppen. Smooth has lower losses, rough is more stable (peel-off) over thermal cycles. You can really buy both, so it is difficult to guess what you have. Your PCB vendor will know what he ordered.
Now I try to include all four layers in the simulation
Why? Do you expect any effect from multiple ground layers in parallel?
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