hey can you send me the reversed schematics! i am always interested in peoples reversing technique - are you stripping layers and using photographs?
to answer your question, power mos shapes like waffle, hexagon, and snake increase the W while keeping the area constant - ie more power in the same area.
the drawback is ESD and snapback - having corners in your die means you have to add offset on the drain side or field concentration will cause early breakdown and bad esd performance and early wearout.
for 150mA driver, I wouldn't worry too much about using straight s-d bars as in the normal mosfet layout. now 2A drivers, that's a different story!
what's your minimum length? if 1um, i'd add 1/2um of setback to enhance esd protection. if less than 1um, you'll need to add more setback.