matrixofdynamism
Advanced Member level 2
When soldering through hole components, since the board is unside down, it often causes the component to disorient.
Basically, one would orient the component correctly, then solder it with the board tilted or upside down. To keep the component in place, one may even use paper tape. However, it often happens that one side of the component is much closer to the PCB surface than the other.
For example, when soldering a through hole 1/4W resistor, one of the sides gets soldered while being significantly closer to the PCB than the other. This is a very annoying problem.
What practices/solutions exist to mitigate this? Should I simply never try to pull the pin of the component as I solder it since even with tape, due to gravity or push from the soldering iron, with the board upside down, the component may go slightly out of place.
Basically, one would orient the component correctly, then solder it with the board tilted or upside down. To keep the component in place, one may even use paper tape. However, it often happens that one side of the component is much closer to the PCB surface than the other.
For example, when soldering a through hole 1/4W resistor, one of the sides gets soldered while being significantly closer to the PCB than the other. This is a very annoying problem.
What practices/solutions exist to mitigate this? Should I simply never try to pull the pin of the component as I solder it since even with tape, due to gravity or push from the soldering iron, with the board upside down, the component may go slightly out of place.